SUSS Technology Forum 2019 - Advanced Photomask Solutions Toward 14 nm and 10 nm
Advanced Photomask Solutions Toward 14 nm and 10 nm
You are cordially invited to the SUSS Photomask Workshop taking place at the Jumeirah Himalayas Hotel at 8:30-12:30 on Wednesday, March 20, 2019, the morning during the 1st day of SEMICON China.
World renowned experts from the mask industry including DNP, FujiFilm, Mitsui Chemical, NuFlare, Photronics, Zeiss and SUSS MicroTec will give their perspectives on challenges and solutions beyond 14 nm - 10 nm mask fabrication and maintenance inside wafer fabs. This workshop will also provide opportunities to network with peers within the photolithography and -mask community.
Moderator: Yuan Zhang, Director Photomask Equipment, SUSS MicroTec Inc.
|08:30 am||Opening Remark
Dr. Franz Richter, CEO
|08:30 am||Multi-Beam Mask Writer for Advanced Patterning
Naoya Hayashi, Research Fellow, DNP
Enabling Wafer Solutions Through Mask Collaboration
|SESSION 1||ADVANCED MASK MANUFACTURING|
|09:25 am||NuFlare VSB Mask Writers for 14 nm and 10 nm Technology Node
Hideki Matsui, Group Manager, NuFlare
|09:45 am||Advanced Acoustic Streaming Technology for Mask Bake and Develop
Manfred Zimmermann, Product Manager, SUSS MicroTec
|10:05 am||Current Status and Prospect of EB Resist for 14 nm and 10 nm Mask Application
Koji Shirakawa, R&D Manager, FujiFilm
Advanced Mask Cleaning Reducing Pattern and Surface Damage
|10:45 am||Coffee Break|
|SESSION 2||ADVANCED MASK MAINTENANCE|
|11:00 am||Mask Pellicle Development for 14 nm and 10 nm
Daiki Taneichi, Senior Researcher, Mitsui Chemical
|11:20 am||Local Pellicle Glue Removal Eliminating Need for Aggressive Final Clean
Dr. Davide Dattilo, Process Scientist, SUSS MicroTec
|11:40 am||E-beam and Defects – a Superlative Nano Playground
Dr. Markus Waiblinger, Senior Product Manager, Carl Zeiss
|12:00 pm||Mask Pattern Defect Inspection Tool Technology
Yoshitaka Yasui, Group Manager, NuFlare
|12:20 pm||Closing Statement
Yuta Nagai, General Manager, SUSS MicroTec
|12:30 pm||End of Forum|
The content is subject to change.