International Conference on Electronics Packaging

Visit SUSS MicroTec at International Conference on Electronics Packaging in Niigata, Japan and discuss latest developments and future directions electronic packaging. Meet our experts and address questions about materials, equipment and processing of your application. For more information visit www.jiep.or.jp/icep

Apr. 17 - Apr. 20, 2019
Niigata, Japan
www.jiep.or.jp/icep