SUSS MicroOptics produces high-quality refractive and diffractive micro-optics for fiber coupling, collimation and beam homogenizing based on extensive experience in optical design, engineering, wafer-level manufacturing, metrology and packaging. SUSS MicroOptics is automotive qualified and key supplier for innovative photonic solutions in telecom, datacom, life science, laser, semiconductor equipment and automotive lighting.
SUSS MicroOptics SA was formed in 1999 with the remit to supply its parent SUSS MicroTec AG with micro-optical elements for their lithography equipment. As the market for micro-optics grew, SUSS MicroOptics expanded to meet the new and diverse requirements, developing its product portfolio and expertise to become one of the leading producers of precision refractive and diffractive micro-optics in the world.
SUSS MicroOptics is recognized by Carl Zeiss SMT GmbH as a Preferred Supplier and first became ISO 9001
certified in 2008. It is currently ISO 9001:2015 and IATF 16949:2016 certified. In 2013 it moved to its current premises, complete with state-of-the-art cleanroom, from where it continues to deliver excellence to its international customer base.
SUSS MicroOptics is a wholly owned subsidiary of SUSS MicroTec SE, a leading supplier of products and solutions for backend lithography, wafer bonding and photomask processing. For more information please visit www.suss.com.
Dr. Reinhard Völkel (CEO)
Diploma, PhD in Physics at University of Erlangen, Prof. Adolf W. Lohmann, Prof. Johannes Schwider IMT Neuchâtel, Prof. Rene
Dandliker, Prof. Hans-Peter Herzig.
More than 25 years experience in diffractive and refractive micro-optics, optical system design, assembling of optical microsystems and optical networks.
More than 20 years experience in fabrication and testing of refractive micro-optics, in optical system design and assembling of optical microsystems. Six Sigma Black Belt.
More than 20 years experience in microtechnology, microelectromechanical system, research and development and process engineering.
Diploma in Physics at Würzburg University in 1971 and his PhD from the Technical University of Munich in 1977.
He has been with Karl Suss since 1977 where he developed diffraction-reducing exposure optics for proximity lithography. He introduced mid-UV and deep-UV systems and presented the first excimer laser exposure system in 1984.
After several years of development in x-ray lithography, he worked in high aspect ratio thick resist applications for MEMS/MST and bump / interconnect technology.
Dr. Elmar Cullmann was the chief scientist of SUSS MicroTec in Munich (FRG).
Diploma in Physics 1963 ETH Zürich, Dr.phil. nat. (physics) 1968 University of Berne, Habilitation (applied physics) 1978 ETH Zürich, since 1978 Prof. (applied optics) University of Neuchâtel, Switzerland, and since 1989 also Prof. EPFL, Lausanne.
Positions: 1963-1969 Institute of Applied Physics, University of Berne, 1969-1970 Philips Research Laboratories, Eindhoven, 1970-1978 Brown Boveri Research Center, Baden, Switzerland, since 1978 Institute of Microtechnology, University of Neuchâtel, Switzerland.
Expertise: interferometry, holography, heterodyne detection, Fourier optics, diffractive and refractive micro-optics, nano-optics (subwavelength optics, SNOM), statistical optics (coherence, speckles), liquid crystal optics.
Honors: Fellow of the OSA, the IoP (London), and the Swiss Society of Optics and Microscopy (SSOM); President of the International Commission for Optics (ICO) and Vice-President of the Swiss Academy of Engineering Sciences (SATW); Topical Editor of Applied Optics (OSA) and an Advisory Editor of Optics Communications.
Diploma in Physics in 1961 TU Dresden, Dr. rer. nat. 1966 Humboldt University Berlin, Dr. sc. techn. 1978 TH Ilmenau, Habilitation 1987, since 1993 appl. Prof. University Erlangen
Positions: 27 years work with the Academy of Sciences in Berlin at Central Institute for Optics and Spectroscopy, 2 years with Heinrich Hertz Institute GmbH in Berlin, since 1990 with at University Erlangen-Nürnberg
Expertise: Physical optics, wave optics, diffraction and interferometry, more than 30 years experience in interferometry, more than 10 years experience in micro-optics diffractive and refractive, more than 10 years engaged in optical interconnects for computers and LAN´s.
SUSS MicroOptics is committed to providing the highest quality products and services.
Our Quality Policy :
Quality is everyone's responsibility.
Our Certifications :
SUSS MicroOptics regularly participates in trade fairs and conferences all around the world. Meet our experts and address questions about materials, equipment and processing of your application.
Meet SUSS MicroTec at the 34rd IEEE International Conference on Micro Electro Mechanical Systems and discuss latest developments and future directions of microsystems technology manufacturing as well as applications. Connect with our experts and address questions about materials, equipment and processing of your application.
Meet SUSS MicroTec at the Technology Unites Global Summit and discuss future digital applications and their demands from the semiconductor world. Connect with our experts and address questions about materials, equipment and processing of your application.
Meet SUSS MicroTec at the FLEX Conference & Exhibition and discuss latest developments and future directions of flexible hybrid, printed electronics products, equipment, processes, and materials, emphasizing the latest technical breakthroughs, unique electronics applications, and business strategies. Connect with our experts and address questions about materials, equipment and processing of your application.
Meet SUSS MicroTec at the ICP APEX EXPO and discuss latest developments and future directions of electronics manufacturing. Connect with our experts and address questions about materials, equipment and processing of your application.
Visit us at SEMICON China 2021 in Shanghai, China and discuss developments and future directions on 3D technology. Meet our experts and address questions about materials, equipment and processing of your application for the 3D Integration, Advanced Packaging, MEMS, Nanotechnology and Compound Semiconductor market.