SUSS MicroOptics uses well-established microfabrication technologies like photolithography, resist processing and reactive ion etching in our cleanroom facilities.
Here you can find more details about the fabrication process.

SUSS MicroOptics is fully equipped for manufacturing in 200 mm wafer size (fused silica & silicon) comprising

• SUSS MicroTec Mask Aligners: MA/BA6, MA8
• SUSS MicroTec Spin Coaters: RC8, ACS200
• SUSS MicroTec Developer System: DV13
• SUSS MicroTec Wafer-Level Packaging: MA8/BA6
• SUSS MicroTec Front-to-Back Tester: DSM8
• STS Reactive Ion Etching Equipment: RIE-ICP, RIE-ICP AOE
• Testing and Inspection Equipment

SUSS MicroOptics profits from the world-wide leadership of SUSS MicroTec in Micro-Electronics production and test devices.